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Note publique d'information : Electrical Conductive Adhesives with Nanotechnologies begins with an overview of electronic
packaging, discussing the various electrical adhesive options currently available.
The book focuses extensively on Electrically Conductive Adhesives (ECAs), as well
as other adhesives such as lead-free soldering, Isotropically Conductive Adhesives
(ICAs), Anisotropically Conductive Adhesives/Films (ACA/ACFs) and Nonconductive Adhesives/Films
(NCA/NCFs). The authors also present examples of how conductive adhesives can be applied
to nano techniques, while making important mentions of recent research and development
breakthroughs in the fields. Drawing upon tireless research, years of theoretical
development and practical experience, and utilizing numerous visual examples and illustrative
applications, authors CP Wong, Yi Li and Daniel Lu cover electrically conductive adhesives
in depth, while also describing: The electrical properties, thermal performance, bonding
pressure, assembly and reliability of numerous types of electrically conductive adhesives
The similarities and differences between lead-free soldering techniques and electrically
conductive adhesives, while also discussing the advantages of ECAs. Insights into
the future of nano ECAs, as well as projections of future industry trends. Electrical
Conductive Adhesives with Nanotechnologies is a must-read for both researchers and
active engineers in the electronic packaging field
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